50347.1 IP-ENG

Résumé

Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability

Textes supplémentaires

Abstract

Develop experimental and numerical methods to predict fracture behavior of adhesively bonded layers in small electronic components, to improve quality and reliability. This will lead to better products at lower costs by emphasizing specific FEA predictions over general design rules.

Participants

Yee Song Ko

Wirtschaftspartner

ams International AG Yee Song Ko Moosstrasse 2 8803 Rüschlikon ZH CH

Pierre Jousset

Kontaktperson

pierre.jousset@ost.ch

OST - Ostschweizer Fachhochschule Pierre Jousset Oberseestrasse 10 8640 Rapperswil SG CH

Détails du projet

Office de recherche: INNOSUISSE
Statut du projet: Abgeschlossen
Type de projet: Forschungsprojekt
Date de début: 2021-02-28
Date de fin: 2023-02-28
Coûts totaux approuvés: CHF 196312.00
Section: 70 Engineering
Domaine politique NABS: Industrielle Produktivität und Technologie

Disciplines de recherche

T210 Mechanical engineering,hydraulics,vacuum techn.,vibration and acoustic eng. 100.0%