49411.1 IP-ENG

Résumé

Integrated Highly Dynamic Position Sensor with Package Stress Compensation

Textes supplémentaires

Abstract

In this project we push forward modern position sensing based on a principle developed in Switzerland. These devices are produced by millions today as microchip for consumer electronics. The goal is to increase their performance to serve the field of robotics and efficient motion control.

Participants

Jens Muttersbach

Wirtschaftspartner

jens.muttersbach@monolithicpower.com

MPS Tech Switzerland Sàrl CHE-114.585.197 Jens Muttersbach Route de Lully 5a 1131 Tolochenaz VD CH

Samuel Huber Lindenberger

Kontaktperson

samuel.huber@ost.ch

OST - Ostschweizer Fachhochschule Buchs Samuel Huber Lindenberger Werdenbergstrasse 4 9471 Buchs SG SG CH

Détails du projet

Office de recherche: INNOSUISSE
Statut du projet: Abgeschlossen
Type de projet: Forschungsprojekt
Date de début: 2020-12-31
Date de fin: 2022-10-31
Coûts totaux approuvés: CHF 305739.00
Section: 70 Engineering
Domaine politique NABS: Industrielle Produktivität und Technologie

Disciplines de recherche

T001 Electronics and Electrical technology 100.0%